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HS-82C37ARH
August 1995
Radiation Hardened CMOS High Performance Programmable DMA Controller
Description
The Intersil HS-82C37ARH is an enhanced, radiation hardened CMOS version of the industry standard 8237A Direct Memory Access (DMA) controller, fabricated using the Intersil hardened field, self-aligned silicon gate CMOS process. The HS-82C37ARH offers increased functionality, improved performance, and dramatically reduced power consumption for the radiation environment. The high speed, radiation hardness, and industry standard configuration of the HS-82C37ARH make it compatible with radiation hardened microprocessors such as the HS-80C85RH and the HS-80C86RH. The HS-82C37ARH can improve system performance by allowing external devices to transfer data directly to or from system memory. Memory-to-memory transfer capability is also provided, along with a memory block initialization feature. DMA requests may be generated by either hardware or software, and each channel is independently programmable with a variety of features for flexible operation. Static CMOS circuit design insures low operating power and allows gated clock operation for an even further reduction of power. Multimode programmability allows the user to select from three basic types of DMA services, and reconfiguration under program control is possible even with the clock to the controller stopped. Each channel has a full 64K address and word count range, and may be programmed to autoinitialize these registers following DMA termination (end of process). The Intersil hardened field CMOS process results in performance equal to or greater than existing radiation resistant products at a fraction of the power.
Features
* Radiation Hardened - Total Dose >105 RAD (Si) - Transient Upset > 108 RAD (Si)/s - Latch Up Free EPI-CMOS * Low Power Consumption - IDDSB = 50A Maximum - IDDOP = 4.0mA/MHz Maximum * Pin Compatible with NMOS 8237A and the Intersil 82C37A * High Speed Data Transfers Up To 2.5 MBPS With 5MHz Clock * Four Independent Maskable Channels With Autoinitialization Capability * Expandable to Any Number of Channels * Memory-to-Memory Transfer Capability * CMOS Compatible * Hardened Field, Self-Aligned, Junction Isolated CMOS Process * Single 5V Supply * Military Temperature Range -55oC to +125oC
Ordering Information
PART NUMBER HS1-82C37ARH-Q HS1-82C37ARH-8 HS1-82C37ARH-Sample HS9-82C37ARH-Q HS9-82C37ARH-8 HS9-82C37ARH/Sample TEMPERATURE RANGE -55oC to +125oC -55oC to +125oC 40 Lead SBDIP 40 Lead SBDIP 40 Lead SBDIP 42 Lead Ceramic Flatpack 42 Lead Ceramic Flatpack 42 Lead Ceramic Flatpack PACKAGE
+25oC -55oC to +125oC -55oC to +125oC +25oC
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207 | Copyright (c) Intersil Corporation 1999
Spec Number File Number
918
518058 3042.1
DB NA
HS-82C37ARH Pinouts
40 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE (SBDIP) MIL-STD-1835 CDIP2-T40 TOP VIEW
IOR IOW MEMR MEMW NC READY HLDA ADSTB AEN HRQ CS CLK 1 2 3 4 5 6 7 8 9 10 11 12 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 A7 A6 A5 A4 EOP A3 A2 A1 A0 VDD DB0 DB1 DB2 DB3 DB4 DACK0 DACK1 DB5 DB6 DB7 IOR IOW MEMR MEMW NC READY HLDA ADSTB AEN HRQ CS CLK RESET DACK2 DACK3 NC DREQ3 DREQ2 DREQ1 DREQ0 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 A7 A6 A5 A4 EOP A3 A2 A1 A0 VDD DB0 DB1 DB2 DB3 DB4 NC DACK0 DACK1 DB5 DB6 DB7
42 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE (FLATPACK) INTERSIL OUTLINE K42.A TOP VIEW
RESET 13 DACK2 14 DACK3 15 DREQ3 16 DREQ2 17 DREQ1 18 DREQ0 19 (GND) VSS 20
Functional Diagram
DECREMENTOR EOP RESET CS READY CLOCK AEN ADSTB MEMR MEMW IOR IOW WRITE BUFFER DREQ0DREQ3 HLDA HDQ DACK0DACK3 4 PRIORITY ENCODER AND ROTATING PRIORITY LOGIC COMMAND (8) INTERNAL DATA BUS I/O BUFFER READ BUFFER D0-D1 TIMING AND CONTROL BASE ADDRESS (16) READ BUFFER BASE WORD COUNT (16) BASE ADDRESS (16) BASE WORD COUNT (16) TEMP WORD COUNT REG (16) 16 BIT BUS 16 BIT BUS OUTPUT BUFFER A4-A7 INC DECREMENTOR TEMP ADDRESS REG (16) I/O BUFFER A0-A3
A8-A15
COMMAND CONTROL
DB0-DB7
4
MASK (4) STATUS (8) TEMPORARY (8)
REQUEST (4)
MODE (4 x 6)
Spec Number 919
518058
HS-82C37ARH Pin Descriptions
SYMBOL VDD PIN NUMBER 31 TYPE DESCRIPTION VDD: is the +5V power supply pin. A 0.1F capacitor between pins 31 and 20 is recommended for decoupling. Ground I CLOCK INPUT: The Clock Input is used to generate the timing signals which control HS-82C37ARH operations. This input may be driven from DC to 5MHz and may be stopped in either high or low state for standby operation. CHIP SELECT: Chip Select is an active low input used to enable the controller onto the data bus for CPU communications. RESET: This is an active high input which clears the Command, Status, Request and Temporary Registers, the First/Last Flip-Flop, and the Mode Register Counter. The Mask Register is Set to ignore requests. Following a Reset, the controller is in an idle cycle. READY: This signal can be sued to extend the memory read and write pulses from the HS-82C37ARH to accommodate slow memories or I/O devices. Ready must not make transitions during its specified set-up and hold times. Ready is ignored in Verify Transfer mode. HOLD ACKNOWLEDGE: The active high Hold Acknowledge from the CPU indicates that is has relinquished control of the system busses. DMA REQUEST: The DMA Request (DREQ) lines are individual asynchronous channel request inputs used by peripheral circuits to obtain DMA service. In Fixed Priority, DREQ0 has the highest priority and DREQ3 has the lowest priority. A request is generated by activating the DREQ line of a channel. DACK will acknowledge the recognition of DREQ signal. Polarity of DREQ is programmable. Reset initializes these lines to active. DREQ will not be recognized while the clock is stopped. Unused DREQ inputs should be pulled High or Low (inactive) and the corresponding mask bit set. DATA BUS: The Data Bus lines are bidirectional three-state signals connected to the system data bus. The outputs are enabled in the Program Condition during the I/O Read to output the contents of a register to the CPU. The outputs are disabled and the inputs are read during an I/O Write cycle when the CPU is programming the HS-82C37ARH Control Registers. During DMA cycles, the most significant 8 bits of the address are output onto the data bus to be strobed into an external latch by ADSTB. In Memory-to-Memory operations, data from the memory enters the HS-82C37ARH on the data bus during the read-from-memory transfer, then during the write-to-memory transfer, the data bus outputs write the data into the new memory location. I/O READ: I/O Read is a bidirectional active low three-state line. In the Idle cycle, it is an input control signal used by the CPU to read the internal registers. In the Active cycle, it is an output control signal used by the HS-82C37ARH to access data from a peripheral during a DMA Write transfer. I/O WRITE: I/O Write is a bidirectional active low three-state line. In the Idle cycle, it is an input control signal used by the CPU to load information into the HS-82C37ARH. In the Active cycle, it is an output control signal used by the HS-82C37ARH to load data to the peripheral during a DMA Read transfer. END OF PROCESS: End of Process (EOP) is an active low bidirectional signal. Information concerning the completion of DMA services is available at the bidirectional EOP pin. The HS-82C37ARH allows an external signal to terminate an active DMA service by pulling the EOP pin low. A pulse is generated by the HS-82C37ARH when terminal count (TC) for any channel is reached, except for channel 0 in Memory-to-Memory mode. During Memory-to-Memory transfers, EOP will be output when the TC for channel 1 occurs. The EOP pin is driven by an open drain transistor on-chip, and requires an external pull-up resistor. When an EOP pulse occurs, whether internally or externally generated, the HS-82C37ARH will terminate the service, and if Autoinitialize is enabled, the base registers will be written to the current registers of that channel. The mask bit and TC bit in the Status Register will be set for the currently active channel by EOP unless the channel is programmed for Autoinitialize. In that case, the mask bit remains clear. Address: The four least significant address lines are bidirectional three-state signals. In the Idle cycle, they are inputs and are used by the HS-80C86RH to address the internal registers to be loaded or read. In the Active cycle, they are outputs and provide the lower 4 bits of the output address.
GND CLK
20 12
CS
11
I
RESET
13
I
READY
6
I
HLDA
7
I
DREQ0DREQ3
16-19
I
DB0DB7
21-23 26-30
I/O
IOR
1
I/O
IOW
2
I/O
EOP
36
I/O
A0-A3
32-35
I/O
Spec Number 920
518058
HS-82C37ARH Pin Descriptions
SYMBOL A4-A7 PIN NUMBER 37-40 (Continued)
TYPE O
DESCRIPTION Address: The four most significant address lines are three-state outputs and provide 4 bits of address. These lines are enabled only during the Active cycle. Hold Request: The Hold Request (HRQ) output is used to request control of the system bus. When a DREQ occurs and the corresponding mask bit is clear, or a software DMA request is made, the HS82C37ARH issues HRQ. The HLDA signal then informs the controller when access to the system busses is permitted. For stand-alone operation where the HS-82C37ARH always controls the busses, HRQ may be tied to HLDA. This will result in one S0 state before the transfer. DMA Acknowledge: DMA acknowledge is used to notify the individual peripherals when one has been granted a DMA cycle. The sense of these lines is programmable. Reset initializes them to active low. Address Enable: Address Enable enables the 8-bit latch containing the upper 8 address bits onto the system address bus. AEN can also be used to disable other system bus drivers during DMA transfers. AEN is active HIGH. Address Strobe: This is an active high signal used to control latching of the upper address byte. It will drive directly the strobe input of external transparent octal latches, such as the 82C82. During block operations, ADSTB will only be issued when the upper address byte must be updated, thus speeding operation through elimination of S1 states. (See Note 2). Memory Read: The Memory Read signal is an active low three-state output used to access data from the selected memory location during a DMA Read or a Memory-to-Memory transfer. Memory Write: The Memory Write is an active low three-state output used to write data to the selected memory location during a DMA Write or a Memory-to-Memory transfer. No connect. Pin 5 is open and should not be tested for continuity.
HRQ
10
O
DACK0DACK3 AEN
14,15, 24, 25 9
O
O
ADSTB
8
O
MEMR
3
O
MEMW
4
O
NC
5
Spec Number 921
518058
Specifications HS-82C37ARH
Absolute Maximum Ratings
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +6.5V Input or Output Voltage Applied . . . . . . . .VSS - 0.3V to VDD + 0.3V for All Grades Storage Temperature Range . . . . . . . . . . . . . . . . . -65oC to +150oC Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . . +300oC Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175oC Typical Derating Factor. . . . . . . . . . . . 4mA/MHz Increase in IDDOP ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Reliability Information
Thermal Resistance JA JC SBDIP Package. . . . . . . . . . . . . . . . . . . . 38oC/W 5oC/W Ceramic Flatpack Package . . . . . . . . . . . 72oC/W 10oC/W Maximum Package Power Dissipation at +125oC Ambient SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.32W Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . . . . 0.69W If device power exceeds package dissipation capability, provide heat sinking or derate linearly at the following rate: SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26.3mW/C Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . .13.9mW/C
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Operating Conditions
Operating Supply Voltage Range (VDD) . . . . . . . . . +4.5V to +5.5V Operating Temperature Range (TA) . . . . . . . . . . . . -55oC to +125oC Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0V to +0.8V Input High Voltage. . . . . . . . . . . . . . . . . . . . . . . . VDD -1.5V to VDD
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS LIMITS PARAMETER TTL Output High Voltage SYMBOL VOH1 CONDITIONS VDD = 4.5V, IO = -2.5mA, VIN = 0V or 4.0V VDD = 4.5V, IO = -100A, VIN = 0V or 4.0V VDD = 4.5V, IO = +2.5mA, VIN = 0V or 4.0V VDD = 5.5V, VIN = 0V or 5.5V Pins: 6, 7, 11-13, 16-19 VDD = 5.5V, VIN = 0V or 5.5V Pins: 1-4, 21-23, 2630, 32-40 VDD = 5.5V, IO = 0mA, VIN = GND or VDD VDD = 5.5V, IO = 0mA, VIN = GND or VDD, f = 5MHz VDD = 4.5V and 5.5V, VIN = GND or VDD, f = 1MHz VDD = 4.5V and 5.5V, VIN = GND or VDD - 1.5V and VDD = 4.5V, VIN = 0.8V or VDD GROUP A SUBGROUP 1, 2, 3 TEMPERATURE +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC MIN 3.0 MAX UNITS V
CMOS Output High Voltage Output Low Voltage
VOH2
1, 2, 3
VDD0.4 -
-
V
VOL1
1, 2, 3
0.4
V
Input Leakage Current
IIL or IIH
1, 2, 3
-1.0
1.0
A A
Output Leakage Current
IOZL or IOZH
1, 2, 3
-10
10
Standby Power Supply Current Operating Power Supply Current
IDDSB
1, 2, 3
+25oC, +125oC, -55oC +25oC, +125oC, -55oC
-
+50
A
IDDOP
1, 2, 3
-
20
mA
Functional Tests
FT
7, 8A, 8B
+25oC, +125oC, -55oC
-
-
-
Noise Immunity Functional Test
FN
7, 8A, 8B
+25oC, +125oC, -55oC
-
-
-
Spec Number 922
518058
Specifications HS-82C37ARH
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS VCC = +5V 10%, GND = 0V, AC's Tested at Worst Case VDD, Guaranteed Over Full Operating Range. LIMITS PARAMETER DMA (MASTER) MODE AEN HIGH from CLK LOW (S1) Delay Time TCLAEH VDD = 4.5V +25oC, +125oC, -55oC 9, 10, 11 175 ns SYMBOL (NOTES 1, 2) CONDITIONS TEMPERATURE SUBGROUP MIN MAX UNITS
DMA (MASTER) MODE (Continued) AEN LOW from CLK HIGH (SI) Delay Time ADR from READ HIGH Hold Time DB from ADSTB LOW Hold Time ADR from WRITE HIGH Hold Time DACK Valid from CLK LOW Delay Time EOP HIGH from CLK HIGH Delay Time EOP LOW from CLK HIGH Delay Time ADR Stable from CLK HIGH TCHAEL VDD = 4.5V +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC 9, 10, 11 130 ns
TRHAX
VDD = 4.5V
9, 10, 11
TCLCL100 TCLCH18 TCLCL50 -
-
ns
TSLDZ
VDD = 4.5V
9, 10, 11
-
ns
TWHAX
VDD = 4.5V
9, 10, 11
-
ns
TCLDAV
VDD = 4.5V
9, 10, 11
170
ns
TCHIPH
VDD = 4.5V
9, 10, 11
-
170
ns
TCHIPL
VDD = 4.5V
9, 10, 11
-
100
ns
TCHAV
VDD = 4.5V
9, 10, 11
-
110
ns
DB to ADSTB LOW Setup Time
TDVSL
VDD = 4.5V
9, 10, 11
TCHCL +10 70
-
ns
Clock HIGH Time (Transitions 10ns) Clock LOW Time (Transitions 10ns) CLK Cycle Time
TCHCL
VDD = 4.5V
9, 10, 11
-
ns
TCLCH
VDD = 4.5V
9, 10, 11
50
-
ns
TCLCL
VDD = 4.5V
9, 10, 11
200
-
ns
CLK HIGH to READ or WRITE LOW Delay READ HIGH from CLK HIGH (S4) Delay Time WRITE HIGH from CLK HIGH (S4) Delay Time HRQ Valid from CLK HIGH Delay Time EOP LOW to CLK LOW Setup Time EOP Pulse Width
TCHRWL
VDD = 4.5V
9, 10, 11
-
190
ns
TCHRH
VDD = 4.5V
9, 10, 11
-
190
ns
TCHWH
VDD = 4.5V
9, 10, 11
-
130
ns
TCHRQV
VDD = 4.5V
9, 10, 11
-
120
ns
TEPLCL
VDD = 4.5V
9, 10, 11
40
-
ns
TEPLEPH
VDD = 4.5V
9, 10, 11
220
-
ns
READ or WRITE Active from CLK HIGH
TCHRWV
VDD = 4.5V
9, 10, 11
-
150
ns
Spec Number 923
518058
Specifications HS-82C37ARH
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) VCC = +5V 10%, GND = 0V, AC's Tested at Worst Case VDD, Guaranteed Over Full Operating Range. LIMITS PARAMETER SYMBOL (NOTES 1, 2) CONDITIONS TEMPERATURE SUBGROUP MIN MAX UNITS
DMA (MASTER) MODE (Continued) DB Float to Active Delay from CLK HIGH HLDA Valid to CLK HIGH Setup Time Input Data from MEMR HIGH Hold Time Input Data to MEMR HIGH Setup Time Output Data from MEMW HIGH HOLD Time Output Data Valid to MEMW HIGH DREQ to CLK LOW (SI, S4) Setup Time CLK LOW to READY Hold Time TCHDV VDD = 4.5V +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC 9, 10, 11 110 ns
TRAVCH
VDD = 4.5V
9, 10, 11
75
-
ns
TMRHDX
VDD = 4.5V
9, 10, 11
0
ns
TDVMRH
VDD = 4.5V
9, 10, 11
155
ns
TMWHDZ
VDD = 4.5V
9, 10, 11
15
ns
TDVMWH
VDD = 4.5V
9, 10, 11
TCLCL35 0
-
ns
TDQVCL
VDD = 4.5V
9, 10, 11
-
ns
TCLRYX
VDD = 4.5V
9, 10, 11
20
-
ns
READY to CLK LOW Setup Time ADSTB HIGH from CLK LOW Delay Time ADSTB LOW from CLK LOW Delay Time READ HIGH Delay from WRITE HIGH READ Pulse Width, Normal Timing ADSTB Pulse Width
TRYVCL
VDD = 4.5V
9, 10, 11
60
-
ns
TCLSH
VDD = 4.5V
9, 10, 11
-
80
ns
TCLSL
VDD = 4.5V
9, 10, 11
-
120
ns
TWHRH
VDD = 4.5V
9, 10, 11
0
-
ns
TRLRH1
VDD = 4.5V
9, 10, 11
2TCLCL -50 TCLCL 80 2TCLCL -100 TCLCL 100 TCLCL 50
-
ns
TSHSL
VDD = 4.5V
9, 10, 11
-
ns
Extended WRITE Pulse Width
TWLWH1
VDD = 4.5V
9, 10, 11
-
ns
WRITE Pulse Width
TWLWH2
VDD = 4.5V
9, 10, 11
-
ns
READ Pulse Width, Compressed PERIPHERAL (SLAVE) MODE ADR Valid or CS LOW to IOR LOW ADR Valid or CS LOW to IOW LOW Setup Time 0 Data Valid to IOW HIGH Setup Time
TRLRH2
VDD = 4.5V
9, 10, 11
-
ns
TAVIRL
VDD = 4.5V
+25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC
9, 10, 11
10
-
ns
TAVIWL
VDD = 4.5V
9, 10, 11
0
-
ns
TDVIWH
VDD = 4.5V
9, 10, 11
150
-
ns
Spec Number 924
518058
Specifications HS-82C37ARH
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) VCC = +5V 10%, GND = 0V, AC's Tested at Worst Case VDD, Guaranteed Over Full Operating Range. LIMITS PARAMETER SYMBOL (NOTES 1, 2) CONDITIONS TEMPERATURE SUBGROUP MIN MAX UNITS
PERIPHERAL (SLAVE) MODE (Continued) ADR or CS Hold from IOR HIGH TIRHAX VDD = 4.5V +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC 9, 10, 11 0 ns
Data Access from IOR
TIRLDV
VDD = 4.5V
9, 10, 11
-
150
ns
RESET to First IOW or IOR
TRSLIRWL
VDD = 4.5V
9, 10, 11
2TCLCL
-
ns
RESET Pulse Width
TRSHRSL
VDD = 4.5V
9, 10, 11
300
-
IOR Width
TIRLIRH
VDD = 4.5V
9, 10, 11
200
-
ns
ADR or CS HIGH from IOW HIGH Hold Time Data from IOW HIGH Hold Time
TIWHAX
VDD = 4.5V
9, 10, 11
0
-
ns
TIWHDX
VDD = 4.5V
9, 10, 11
10
-
ns
IOW Width
TIWLIWH
VDD = 4.5V
9, 10, 11
150
-
ns
NOTES: 1. READ refers to both IOR and MEMR, and WRITE refers to both IOW and MEMW, during memory to I/O and I/O to memory transfers 2. AC's Tested at Worst Case VDD But Guaranteed Over Full Operating Range
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS LIMITS PARAMETER Input Capacitance SYMBOL CIN CONDITIONS VDD = Open, f = 1MHz, All measurements referenced to device ground. VDD = Open, f = 1MHz, All measurements referenced to device ground. VDD = Open, f = 1MHz, All measurements referenced to device ground. VDD = 4.5V and 5.5V VDD = 4.5V and 5.5V VDD = 4.5V and 5.5V VDD = 4.5V and 5.5V VDD = 4.5V and 5.5V TEMPERATURE TA = +25oC MIN MAX 15 UNITS pF
Output Capacitance
COUT
TA = +25oC
-
15
pF
I/O Capacitance
CI/O
TA = +25oC
-
20
pF
ADR Active to Float Delay from CLK HIGH READ or WRITE Float Delay from CLK HIGH DB Active to Float Delay from CLK HIGH DB Float Delay from IOR HIGH Power Supply HIGH to RESET LOW Setup Time
TCHAZ TCHRWZ TCHDZ TIRHDZ TPHRSL
-55oC < TA < +125oC -55oC < TA < +125oC
10 500
90 120 170 85 -
ns ns ns ns ns
-55oC < TA < +125oC -55oC -55oC < TA < < TA < +125oC +125oC
NOTE: The parameters listed in Table 3 are controlled via design or process parameters and are not directly tested. These parameters are characterized upon initial design release and upon design changes which would affect these characteristics.
Spec Number 925
518058
Specifications HS-82C37ARH
TABLE 4. POST 100K RAD ELECTRICAL PERFORMANCE CHARACTERISTICS NOTE: See +25oC limits in Table 1 and Table 2 for Post RAD limits (Subgroups 1, 7 and 9). TABLE 5. BURN-IN DELTA PARAMETERS (+25oC) PARAMETER Standby Power Supply Current Output Leakage Current Input Leakage Current Output Low Voltage TTL Output High Voltage CMOS Output High Voltage SYMBOL IDDSB IOZL, IOZH IIH, IIL VOL VOH1 VOH2 DELTA LIMITS 20A 2A 200nA 80mV 600mV 150mV
TABLE 6. APPLICABLE SUBGROUPS GROUP A SUBGROUPS CONFORMANCE GROUP Initial Test Interim Test PDA Final Test Group A (Note 1) Subgroup B5 Subgroup B6 Group C Group D Group E, Subgroup 2 NOTES: 1. Alternate Group A testing in accordance with MIL-STD-883 method 5005 may be exercised. 2. Table 5 parameters only MIL-STD-883 METHOD 100% 5004 100% 5004 100% 5004 100% 5004 Sample 5005 Sample 5005 Sample 5005 Sample 5005 Sample 5005 Sample 5005 TESTED FOR -Q 1, 7, 9 1, 7, 9, 1, 7, 2, 3, 8A, 8B, 10, 11 1, 2, 3, 7, 8A, 8B, 9, 10, 11 1, 2, 3, 7, 8A, 8B, 9, 10, 11, 1, 7, 9 N/A 1, 7, 9 1, 7, 9 RECORDED FOR -Q 1 (Note 2) 1, (Note 2) 1, 2, 3, (Note 2) N/A TESTED FOR -8 1, 7, 9 1, 7, 9 1, 7 2, 3, 8A, 8B, 10, 11 1, 2, 3, 7, 8A, 8B, 9, 10, 11 N/A N/A 1, 2, 3, 7, 8A, 8B, 9, 10, 11 1, 7, 9 1, 7, 9 RECORDED FOR -8
Spec Number 926
518058
HS-82C37ARH Intersil Space Level Product Flow -Q
Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 2 Samples/Wafer, 0 Rejects 100% Die Attach 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method 2011 Sample - Die Shear Monitor, Method 2019 or 2027 100% Internal Visual Inspection, Method 2010, Condition A CSI and/or GSI PreCap (Note 6) 100% Temperature Cycle, Method 1010, Condition C, 10 Cycles 100% Constant Acceleration, Method 2001, Condition per Method 5004 100% PIND, Method 2020, Condition A 100% External Visual 100% Serialization 100% Initial Electrical Test (T0) 100% Static Burn-In 1, Condition A or B, 72 Hours Min, +125oC Min, Method 1015
NOTES: 1. Failures from subgroup 1, 7 and deltas are used for calculating PDA. The maximum allowable PDA = 5% with no more than 3% of the failures from subgroup 7. 2. Radiographic (X-Ray) inspection may be performed at any point after serialization as allowed by Method 5004. 3. Alternate Group A testing may be performed as allowed by MIL-STD-883, Method 5005. 4. Group B and D inspections are optional and will not be performed unless required by the P.O. When required, the P.O. should include separate line items for Group B Test, Group B Samples, Group D Test and Group D Samples. 5. Group D Generic Data, as defined by MIL-I-38535, is optional and will not be supplied unless required by the P.O. When required, the P.O. should include a separate line item for Group D Generic Data. Generic data is not guaranteed to be available and is therefore not available in all cases. 6. CSI and/or GSI inspections are optional and will not be performed unless required by theP.O. When required, the P.O. should include separate line items for CSI PreCap inspection, CSI final inspection, GSI PreCap inspection, and/or GSI final inspection. 7. Data Package Contents: * Cover Sheet (Intersil Name and/or Logo, P.O. Number, Customer Part Number, Lot Date Code, Intersil Part Number, Lot Number, Quantity). * Wafer Lot Acceptance Report (Method 5007). Includes reproductions of SEM photos with percent of step coverage. * GAMMA Radiation Report. Contains Cover page, disposition, Rad Dose, Lot Number, Test Package used, Specification Numbers, Test equipment, etc. Radiation Read and Record data on file at Intersil. * X-Ray report and film. Includes penetrometer measurements. * Screening, Electrical, and Group A attributes (Screening attributes begin after package seal). * Lot Serial Number Sheet (Good units serial number and lot number). * Variables Data (All Delta operations). Data is identified by serial number. Data header includes lot number and date of test. * Group B and D attributes and/or Generic data is included when required by the P.O. * The Certificate of Conformance is a part of the shipping invoice and is not part of the Data Book. The Certificate of Conformance is signed by an authorized Quality Representative.
100% Interim Electrical Test 1 (T1) 100% Delta Calculation (T0-T1) 100% PDA 1, Method 5004 (Note 1) 100% Dynamic Burn-In, Condition D, 240 Hours, +125oC or Equivalent, Method 1015 100% Interim Electrical Test 2(T2) 100% Delta Calculation (T0-T2) 100% PDA 2, Method 5004 (Note 1) 100% Final Electrical Test 100% Fine/Gross Leak, Method 1014 100% Radiographic (X-Ray), Method 2012 (Note 2) 100% External Visual, Method 2009 Sample - Group A, Method 5005 (Note 3) Sample - Group B, Method 5005 (Note 4) Sample - Group D, Method 5005 (Notes 4 and 5) 100% Data Package Generation (Note 7) CSI and/or GSI Final (Note 6)
Spec Number 927
518058
HS-82C37ARH Intersil Space Level Product Flow -8
GAMMA Radiation Verification (Each Wafer) Method 1019, 2 Samples/Wafer, 0 Rejects 100% Die Attach Periodic- Wire Bond Pull Monitor, Method 2011 Periodic- Die Shear Monitor, Method 2019 or 2027 100% Internal Visual Inspection, Method 2010, Condition B CSI an/or GSI PreCap (Note 5) 100% Temperature Cycle, Method 1010, Condition C, 10 Cycles 100% Constant Acceleration, Method 2001, Condition per Method 5004 100% External Visual 100% Initial Electrical Test
NOTES: 1. Failures from subgroup 1, 7 are used for calculating PDA. The maximum allowable PDA = 5%. 2. Alternate Group A testing may be performed as allowed by MIL-STD-883, Method 5005. 3. Group B, C and D inspections are optional and will not be performed unless required by the P.O. When required, the P.O. should include separate line items for Group B Test, Group C Test, Group C Samples, Group D Test and Group D Samples. 4. Group C and/or Group D Generic Data, as defined by MIL-I-38535, is optional and will not be supplied unless required by the P.O. When required, the P.O. should include a separate line item for Group C Generic Data and/or Group D Generic Data. Generic data is not guaranteed to be available and is therefore not available in all cases. 5. CSI and/or GSI inspections are optional and will not be performed unless required by theP.O. When required, the P.O. should include separate line items for CSI PreCap inspection, CSI final inspection, GSI PreCap inspection, and/or GSI final inspection. 6. Data Package Contents: * Cover Sheet (Intersil Name and/or Logo, P.O. Number, Customer Part Number, Lot Date Code, Intersil Part Number, Lot Number, Quantity). * GAMMA Radiation Report. Contains Cover page, disposition, Rad Dose, Lot Number, Test Package used, Specification Numbers, Test equipment, etc. Radiation Read and Record data on file at Intersil. * Screening, Electrical, and Group A attributes (Screening attributes begin after package seal). * Group B, C and D attributes and/or Generic data is included when required by the P.O. * The Certificate of Conformance is a part of the shipping invoice and is not part of the Data Book. The Certificate of Conformance is signed by an authorized Quality Representative.
100% Dynamic Burn-In, Condition D, 160 Hours, +125oC or Equivalent, Method 1015 100% Interim Electrical Test 100% PDA, Method 5004 (Note 1) 100% Final Electrical Test 100% Fine/Gross Leak, Method 1014 100% External Visual, Method 2009 Sample - Group A, Method 5005 (Note 2) Sample - Group B, Method 5005 (Note 3) Sample - Group C, Method 5005 (Notes 3 and 4) Sample - Group D, Method 5005 (Notes 3 and 4) 100% Data Package Generation (Note 6) CSI and/or GSI Final (Note 5)
AC Test Circuit
V1 R1
AC Testing Input, Output Waveforms
VDD -1.5V INPUT VIL -0.4V 1.5V VOH OUTPUT VOL
OUTPUT FROM DEVICE UNDER TEST C1*
TEST POINT Z OUTPUT L OR H 2.0V 0.8V VOL VOH L OR H VOH VOH - 0.45V 0.45 Z
*Includes Stray and Jig Capacitance
TEST CONDITION DEFINITION TABLE PINS All Output Except EOP EOP V1 1.7V VDD R1 510 1.6K C1 100pF 50pF
Spec Number 928
518058
HS-82C37ARH Waveforms
CS TIWHAX TIWLIWH IOW TAVIWL A0-A3 INPUT VALID TIWHDX TDVIWH DB0-DB7 INPUT VALID TIWHAX
FIGURE 1. SLAVE MODE TIMING NOTE: Host system must allow at least TCLCL as recovery time between successive write accesses
CS
A0-A3 TAVIRL
ADDRESS MUST BE VALID TIRHAX TIRLIRH
IOR TIRLDV DB0-DB7 TIRHDZ
DATA OUT VALID
FIGURE 2. SLAVE MODE READ NOTE: Host system must allow at least TCLCL as recovery time between successive write accesses
S2
S3
SW
SW
S4
CLK TCHRH
TCHRWL
READ* TCHRWL TCHRWL TCHWH
WRITE*
EXTENDED WRITE
TCLRYX TRYVCL
TCLRYX TRYVCL
READY
FIGURE 3. READY * READ refers to both IOR and MEMR outputs. WRITE refers to both IOW and MEMW outputs
Spec Number 929
518058
HS-82C37ARH Waveforms
SI CLK TDQVCL DREQ TCHRQV HRQ TRAVCH HLDA TCLAEH AEN TCLSH TSHSL ADSTB TDVSL TCHDV DB0-DB7 TCHAV A0-A7 A8-A15 TCHAV TCHDZ ADDRESS VALID TCLDAV DACK TCHRWV READ* TCHWH TCHRWL WRITE* TWLWH1 INT EOP (FOR EXTENDED WRITE) TEPLEPH EXT EOP TCHIPL TCHRWL TCHIPH TCHWH TWLWH2 TCHRWL TCHRH TWHAX ADDRESS VALID TRHAX TCHRWL TCHRH TWHRH TRLRH1 TCHRWZ TRHAZ TCHAZ TWHAZ TSLDZ TCLDAV TEPLCL TCLSL TCHAEL TDQVCL TCLCL TCLCH TCHRQV TCHCL
(Continued)
SI
S0
S0
S1
S2
S3
S4
S2
S3
S4
S1
SI
SI
FIGURE 4. DMA TRANSFER * READ refers to both IOR and MEMR outputs. WRITE refers to both IOW and MEMW outputs
Spec Number 930
518058
HS-82C37ARH Waveforms
S0 CLK TCLSH TCLSL ADSTB TSLDZ TCHAV A0 - A7 ADDRESS VALID TCHDZ TCHDV DB0 - DB7 A8 - A15 TCHRH TMRHDX MEMR TDVMRH TCHWH TCHRVW TCHRWL TCHRWL IN A8 - A15 TCHDV OUT TCHAV TSLDZ
(Continued)
S11 S12 S13 S14 S21 S22 S23 S24 SI
TCLSH
TCLSL
TCHAZ
ADDRESS VALID
TCHRWL
TDVMWH TMWHDZ
TCHRWZ EXTENDED WRITE TCHIPL INT EOP TCHIPH
TEPLCL TEPLEPH
FIGURE 5. MEMORY-TO-MEMORY TRANSFER
VDD
TPHRSL TRSHRSL
RESET TRSLIRWL IOR OR IOW
FIGURE 6. RESET
Spec Number 931
518058
HS-82C37ARH Waveforms
(Continued)
S2 S4 S2 S4
CLK
TCHAV
TCHAV
A0 - A7
VALID TCHRH TCHRWL TRLRH2 TCHRWL
VALID
TCHRH
READ*
TCHWH TCHWH
WRITE* TCLRYX TRYVCL TCLRYX TRYVCL
READY
FIGURE 7. COMPRESSED TRANSFER * READ refers to both IOR and MEMR outputs. WRITE refers to both IOW and MEMW outputs
Spec Number 932
518058
HS-82C37ARH Burn-In Circuits
HS-82C37ARH 40 LEAD SBDIP
VDD 1 1 2 3 4 5 6 7 8 9 10 11 F0 F1 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 F1 F2 F3 F4 F0 F5 LOAD LOAD LOAD LOAD LOAD F0 LOAD LOAD NC 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 LOAD LOAD F2 F1 F0 F5 F4 F3
HS-82C37ARH 40 LEAD SBDIP
VDD LOAD LOAD LOAD LOAD
VDD
STATIC CONFIGURATION NOTES: 1. VDD = +6.0V 5% 2. TA = +125oC Minimum Part is Static Sensitive Voltage Must be Ramped
LOAD
2.7K
2.7K
3. Resistors: R1 = 10k 10% (Pins 6, 7, 11-13, 17 - 20) R2 = 2.7k 5% (Pins 1, 2, 21-23, 24, 28-32, 34-39)
F0
F1
START-UP TIMING NOTES: 1. F0 is 50% duty cycle square wave pulse burst. 2. 1.0kHz F0 100kHz F0 is left High after pulse burst 3. 10 cycles F0 Pulse Burst 1.0s 4. F1 = Single pulse with width equal to 2 cycles of F0 5. F1 is left Low after pulse burst 6. F1 pulse occurs after start of F0 and ends before F0. Input levels: 0.9VDD VIH VDD, -0.3V VIL 0.7V NOTES:
DYNAMIC CONFIGURATION 1. VDD = 6.5V 5% (Burn-In) 2. VDD = 6.0V 5% (Life Test) 3. TA = +125oC Minimum 4. Part is Static Sensitive, Voltage Must be Ramped 5. Resistors: R1 = 10k 10% (Pins 6, 7, 11-13, 17 - 20) R2 = 2.7k 10% (Pins 1, 2, 22-24, 28-32, 34-37, and LOADS)
Spec Number 933
518058
HS-82C37ARH Burn-In Circuits
(Continued) HS-82C37ARH 42 LEAD CERAMIC FLATPACK
VDD 1 2 3 4 5 6 7 8 9 10 11 F0 F1 12 13 14 15 16 17 18 19 20 21 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 F1 F2 F3 F4 F0 F5 LOAD LOAD OPEN LOAD LOAD LOAD F0 LOAD LOAD OPEN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 OPEN LOAD LOAD F2 F1 F0 F5 F4 F3 VDD LOAD LOAD LOAD LOAD
HS-82C37ARH 42 LEAD CERAMIC FLATPACK
VDD
STATIC CONFIGURATION
2.7K
NOTES: 1. VDD = +6.0V 5% 2. TA = +125oC Minimum Part is Static Sensitive Voltage Must be Ramped
LOAD 2.7K
3. Resistors: R1 = 10k 10% (Pins 6, 7, 11-13, 16-19) R2 = 2.7k 5% (Pins 1, 2, 21-23, 26-30, 32-36)
F0
F1
START-UP TIMING NOTES: 1. F0 is 50% duty cycle square wave pulse burst. 2. 1.0kHz F0 100kHz F0 is left High after pulse burst 3. 10 cycles F0 Pulse Burst 1.0s 4. F1 = Single pulse with width equal to 2 cycles of F0 5. F1 is left Low after pulse burst 6. F1 pulse occurs after start of F0 and ends before F0. Input levels: 0.9VDD VIH VDD, -0.3V VIL 0.7V NOTES:
DYNAMIC CONFIGURATION 1. VDD = 6.5V 5% (Burn-In) 2. VDD = 6.0V 5% (Life Test) 3. TA = +125oC Minimum 4. Part is Static Sensitive, Voltage Must be Ramped 5. Resistors: R1 = 10k 10% (Pins 6, 7, 11-13, 16-19) R2 = 2.7k 10% (Pins 1, 2, 21-23, 26-30, 32-36, and LOADS)
Spec Number 934
518058
HS-82C37ARH Irradiation Circuit
R 1 R 2 LOAD LOAD NC R R 7 LOAD LOAD LOAD R TOGGLE CLOCK RESET TOGGLE R 12 R 13 LOAD 2 LOAD 2 R R 17 R 18 R 19 VSS 20 14 15 16 8 9 10 11 34 R 33 R 32 31 30 29 28 27 26 25 24 23 22 21 VCC LOAD 2 LOAD 2 LOAD 2 LOAD 2 LOAD 2 LOAD 2 LOAD 2 LOAD 2 LOAD 2 LOAD 2 2.7K VSS LOAD 2 OUT 5.5V 3 4 5 6 39 38 37 36 R 35 R VSS 2.7K LOAD LOAD 2.7K LOAD R OUT 40 LOAD LOAD VCC
NOTES: 1. R = 47k 2. Pins with Load: 3, 4, 8, 9, 10, 37-40 Pins with Load2: 14, 15, 21-30 Pins Brought Out: 12 (Clock), 13 (Reset) 3. VDD = 5.5V 0.5V
Spec Number 935
518058
HS-82C37ARH Functional Description
The HS-82C37ARH Direct Memory Access Controller is designed to improve the data transfer rate in systems which must transfer data from an I/O device to memory, or move a block of memory to an I/O device. It will also perform memory-to-memory block moves, or fill a block of memory with data from a single location. Operating modes are provided to handle single byte transfers as well as discontinuous data streams, which allows the HS-82C37ARH to control data movement with software transparency. The DMA controller is a state-driven address and control signal generator, which permits data to be transferred directly from an I/O device to memory or vice versa without ever being stored in a temporary register. This can greatly increase the data transfer rate for sequential operations, compared with processor moves or repeated string instructions. Memory-to-Memory operations require temporary internal storage of the data byte between generation of the source and destination addresses, so Memory-to-Memory transfers take place at less than half the rate of I/O operations, but still much faster than with central processor techniques. The maximum data transfer rate obtainable with the HS-82C37ARH is approximately 2.5 Mbytes/second, for an I/O operation using the compressed timing option and 5MHz clock. The block diagram of the HS-82C37ARH is shown on page 2. The Timing and Control Block, Priority Block, and internal registers are the main components. Figure 8 lists the name and size of the internal registers. The Timing and Control Block derives internal timing from the CLOCK input, and generates external control signals. The Priority Encoder Block resolves priority contention between DMA channels requesting service simultaneously.
NAME Base Address Registers Base Word Count Registers Current Address Registers Current Word Count Registers Temporary Address Register Temporary Word Count Register Status Register Command Register Temporary Register Mode Registers Mask Registers Request Register SIZE 16 Bits 16 Bits 16 bits 16 bits 16 bits 16 bits 8 bits 8 bits 8 bits 6 bits 4 bits 4 bits NUMBER 4 4 4 4 1 1 1 1 1 4 1 1
address byte. While inactive, the controller's outputs are in a high impedance state. When activated by a DMA request and bus control is relinquished by the host, the HS82C37ARH drives the busses and generates the control signals to perform the data transfer. The operation performed by activating one of the four DMA request inputs has previously been programmed into the controller via the Command, Mode, Address, and Word Count Registers. For example, if a block of data is to be transferred from RAM to an I/O device, the starting address of the data is loaded into the HS-82C37ARH Current and Base Address Registers for a particular channel, and the length of the block is loaded into that channel's Word Count Register. The corresponding Mode Register is programmed for a Memory-to-I/O operation (read transfer), and various options are selected by the Command Register and other Mode Register bits. The channel's mask bit is cleared to enable recognition of a DMA request (DREQ). The DREQ can either be a hardware signal or a software command. Once initiated, the block DMA transfer will proceed as the controller outputs the data address, simultaneous MEMR and IOW pulses, and selects an I/O device via the DMA acknowledge (DACK) outputs. The data byte flows directly from the RAM to the I/O device. After each byte is transferred, the address is automatically incremented (or decremented) and the word count is decremented. The operation is then repeated for the next byte. The controller stops transferring data when the Word Count Register underflows, or an external EOP is applied. To further understand HS-82C37ARH operation, the states generated by each clock cycle must be considered. The DMA controller operates in two major cycles, Active and Idle. After being programmed, the controller is normally Idle until a DMA request occurs on an unmasked channel, or a software request is given. The HS-82C37ARH will then request control of the system busses and enter the Active cycle. The Active cycle is composed of several internal states, depending on what options have been selected and what type of operation has been requested. The HS-82C37ARH can assume seven separate states, each composed of one full clock period. State I (SI) is the Idle state. It is entered when the HS-82C37ARH has no valid DMA requests pending, at the end of a transfer sequence, or when a Reset or Master Clear has occurred. While in SI, the DMA controller is inactive but may be in the Program Condition (being programmed by the processor.) State 0 (S0) is the first state of a DMA service. The HS82C37ARH has requested a hold but the processor has not yet returned an acknowledge. The HS-82C37ARH may still be programmed until it has received HLDA from the CPU. An acknowledge from the CPU will signal that DMA transfers may begin. S1, S2, S3 and S4 are the working states of the DMA service. If more time is needed to complete a transfer than is available with normal timing, wait states (SW) can be inserted between S2 or S3 and S4 by the use of the Ready line on the HS-82C37ARH.
FIGURE 8 . HS-82C37ARH INTERNAL REGISTERS
DMA Operation
In a system, the HS-82C37ARH address and control outputs and data bus pins are basically connected in parallel with the system busses. An external latch is required for the upper
Spec Number 936
518058
HS-82C37ARH
Note that the data is transferred directly from the I/O device to memory (or vice versa) with IOR and MEMW (or MEMR and IOW) being active at the same time. The data is not read into or driven out of the HS-82C37ARH in I/O-to-memory or memory-to-I/O DMA transfers. Memory-to-Memory transfers require a read-from and a write-to-memory to complete each transfer. The states, which resemble the normal working states, use two-digit numbers for identification. Eight states are required for a single transfer. The first four states (S11, S12, S13, S14 are used for the read-from-memory half and the last four states (S21, S22, S23, S24) for the write-to-memory half of the transfer. Status Register is set, an EOP pulse is generated, and the channel will Autoinitialize if this option has been selected. If not programmed to Autoinitialize, the mask bit will be set, along with the TC bit and EOP pulse. DREQ must be held active until DACK becomes active. If DREQ is held active throughout the single transfer (there-by triggering a second transfer), HRQ will still go inactive and release the bus to the system. Then it will again go active and, upon receipt of a new HLDA, another single transfer will be performed, unless a higher priority channel takes over. In HS-80C85RH or HS-80C86RH systems, this will ensure one full machine cycle execution between DMA transfers. Details of timing between the HS-82C37ARH and other bus control protocols will depend upon the characteristics of the microprocessor involved. Block Transfer Mode - In Block Transfer Mode, the device is activated by DREQ or software request and continues making transfers during the service until a TC, caused by word count going to FFFFH, or an external End of Process (EOP) is encountered. DREQ need only beheld active until DACK becomes active. Again, an Autoinitialization will occur at the end of the service if the channel has been programmed for that option. Demand Transfer Mode - In Demand Transfer Mode the device continues making transfers until a TC or external EOP is encountered, or until DREQ goes inactive. Thus, transfers may continue until the I/O device has exhaust edits data capacity. After the I/O device has had a chance to catch up, the DMA service is reestablished by means of a DREQ. During the time between services when the micro-processor is allowed to operate, the intermediate values of address and word count are stored in the HS-82C37ARH Current Address and Current Word Count Registers. Higher priority channels may intervene in the demand process, once DREQ has gone inactive. Only an EOP can cause an Autoinitialization at the end of the service. EOP is generated either by TC or by an external signal. Cascade Mode - This mode is used to cascade more than one HS-82C37ARH for simple system expansion. The HRQ and HLDA signals from the additional HS-82C37ARH are connected to the DREQ and DACK signals respectively of a channel for the initial HS-82C37ARH. This allows the DMA requests of the additional device to propagate through the priority network circuitry of the preceding device. The priority chain is preserved and the new device must wait for its turn to acknowledge requests. Since the cascade channel of the initial HS-82C37ARH is used only for prioritizing the additional device, it does not output an address or control signals of its own so that there is no conflict with the cascaded device. The HS-82C37ARH will respond to DREQ and generate DACK but all other outputs except HRQ will be disabled. An external EOP will be ignored by the initial device, but will have the usual effect on the added device. Figure 9 shows two additional devices cascaded with an initial device using two of the previous channels. This forms a two-level DMA system. More HS-82C37ARHs could be added at the second level by using the remaining channels of the first level. Additional devices can also be added by cascading into the channels of the second level devices, forming a third level. Spec Number 937
Idle Cycle
When no channel is requesting service, the HS-82C37ARH will enter the Idle cycle and perform "SI" states. In this cycle, the HS-82C37ARH will sample the DREQ lines on the falling edge of every clock cycle to determine if any channel is requesting a DMA service. Note that for standby operation where the clock has been stopped, DMA requests will be ignored. The device will respond to CS (chip select), in case of an attempt by the microprocessor to write or read the internal registers of the HS-82C37ARH. When CS is low and HLDA is low, the HS82C37ARH enters the Program Condition. The CPU can now establish, change or inspect the internal definition of the part by reading from or writing to the internal registers. The HS-82C37ARH may be programmed with the clock stopped, provided that HLDA is low and at least one rising clock edge has occurred after HLDA was driven low, so the controller is in an SI state. Address lines A0-A3 are inputs to the device and select which registers will be read or written. The IOR and IOW lines are used to select and time the read or write operations. Due to the number and size of the internal registers, an internal flip-flop is used to generate an additional bit of address. The bit is used to determine the upper or lower byte of the 16-bit Address and Word Count Registers. The flip-flop is reset by Master Clear or Reset. Separate software commands can also set or reset this flip-flop. Special software commands can be executed by the HS82C37ARH in the Program Condition. These commands are decoded as sets of addresses with CS, IOR, and IOW. The commands do not make use of the data bus. Instructions include Set and Clear First/Last Flip-Flop, Master Clear, Clear Mode Register Counter, and Clear Mask Register.
Active Cycle
When the HS-82C37ARH is in the Idle cycle, and a software request or an unmasked channel requests a DMA service, the device will output an HRQ to the microprocessor and enter the Active cycle. It is in this cycle that the DMA service will take place, in one of four modes: Single Transfer Mode - In Single Transfer mode, the device is programmed to make one transfer only. The word count will be decremented and the address decremented or incremented following each transfer. When the word count "rolls over" from zero to FFFFH, a terminal count (TC) bit in the
518058
HS-82C37ARH
2ND LEVEL
gram effort and time, the HS-82C37ARH includes a Memory-to-Memory transfer feature. Programming a bit in the Command Register selects channels 0 and 1 to operate as Memory-to-Memory transfer channels. The transfer is initiated by setting the software or hardware DREQ for channel 0. The HS-82C37ARH requests a DMA service in the normal manner. After HLDA is true, the device, using four-state transfers in Block Transfer Mode, reads data from the memory. The channel 0 Current Address Register is the source for the address used and is decremented or incremented in the normal manner. The data byte read from the memory is stored in the HS-82C37ARH internal Temporary Register. Another four-state transfer moves the data to memory using the address in channel 1's Current Address Register and incrementing or decrementing it in the normal manner. The channel 1 Current Word Count Register is decremented. When the word count of channel 1 goes to FFFFH, a TC is generated causing an EOP output terminating the service. Channel 0 word count decrementing to FFFFH will not set the channel 0 TC bit in the Status Register or generate an EOP in this mode. It will cause an Autoinitialization of channel 0, if that option has been selected. If full Autoinitialization for a Memory-to-Memory operation is desired, the channel 0 and channel 1 word counts must be set equal before the transfer begins. Otherwise, if channel 0 underflows before channel 1, it will Autoinitialize and set the data source address back to the beginning of the block. If the channel 1 word count underflows before channel 0, the Memory-to-Memory DMA service will terminate, and channel 1 will Autoinitialize but channel 0 will not. In Memory-to-Memory Mode, Channel 0 may be programmed to retain the same address for all transfers. This allows a single byte to be written to a block of memory. This channel 0 address hold feature is selected by bit 1 in the Command Register. The HS-82C37ARH will respond to external EOP signals during Memory-to-Memory transfers, but will only relinquish the system busses after the transfer is complete (i.e., after an S24 state). Data comparators in block search schemes may use this input to terminate the service when a match is found. The timing of Memory-to-Memory transfers is found in Figure 5. Memory-to-Memory operations can be detected as an active AEN with no DACK outputs. Priority - The HS-82C37ARH has two types of priority encoding available as software selectable options. The first is Fixed Priority which fixes the channels in priority order based upon the descending value of their numbers. The channel with the lowest priority is 3 followed by 2, 1 and the highest priority channel, 0. After the recognition of any one channel for service, the other channels are prevented from interfering with the service until it is completed. The second scheme is Rotating Priority. The last channel to get service becomes the lowest priority channel with the others rotating accordingly. The next lower channel from the channel serviced has highest priority on the following request: Priority rotates every time control of the system busses is returned to the processor. Spec Number 938
HS-80C86RH MICROPROCESSOR
HS-82C37ARH 1ST LEVEL HRQ HLDA DREQ DACK HRQ HLDA
HS-82C37ARH
DREQ DACK INITIAL DEVICE
HRQ HLDA HS-82C37ARH
ADDITIONAL DEVICES
FIGURE 9. CASCADED HS-82C37ARHs
When programming cascaded controllers, start with the first level (closest to the microprocessor). After RESET, the DACK outputs are programmed to be active low and are held in the high state. If they are used to drive HLDA directly, the second level device(s) cannot be programmed until DACK polarity is selected as active high on the initial device. Also, the initial device's mask bits function normally on cascaded channels, so they may be used to inhibit second-level services.
Transfer Types
Each of the three active transfer modes can perform three different types of transfers. These are Read, Write and Verify. Write transfers move data from an I/O device to the memory by activating MEMW and IOR. Read transfers move data from memory to an I/O device by activating MEMR and IOW. Verify transfers are pseudo-transfers. The HS-82C37ARH operates as in Read or Write transfers generating addresses and responding to EOP, etc., however the memory and I/O control lines all remain inactive. Verify mode is not permitted for Memory-to-Memory operation. Ready is ignored during Verify transfers. Autoinitialize - By programming a bit in the Mode Register, a channel may be set up as an Autoinitialize channel. During Autoinitialization, the original values of the Current Address and Current Word Count Registers are automatically restored from the Base Address and Base Word Count Registers of that channel following EOP. The base registers are loaded simultaneously with the current registers by the microprocessor and remain unchanged throughout the DMA service. The mask bit is not set when the channel is in Autoinitialize. Following Autoinitialization, the channel is ready to perform another DMA service, without CPU intervention, as soon as a valid DREQ is detected, or software request made. Memory-to-Memory - To perform block moves of data from one memory address space to another with minimum of pro-
518058
HS-82C37ARH
Rotating Priority 1sr
Service 2nd Service 3rd Service
Programming
The HS-82C37ARH will accept programming from the host processor anytime that HLDA is inactive, and at least one rising clock edge has occurred after HLDA went low. It is the responsibility of the host to assure that programming and HLDA are mutually exclusive.
service
Highest 0 1 2 Lowest 3 service
2 3 0 1
service request
3 0 1 2
With Rotating Priority in a single chip DMA system, any device requesting service is guaranteed to be recognized after no more than three higher priority services have occurred. This prevents any one channel from monopolizing the system. Regardless of which priority scheme is chosen, priority is evaluated every time a HLDA is returned to the HS-82C37ARH. Compressed Timing - In order to achieve even greater throughput where system characteristics permit, the HS82C37ARH can compress the transfer time to two clock cycles. From Figure 4 it can be seen that state S3 is used to extend the access time of the read pulse. By removing state S3, the read pulse width is made equal to the write pulse width and a transfer consists only of state S2 to change the address and state S4 to perform the read/write. S1 states will still occur when A8-A15 need updating (see Address Generation). Timing for compressed transfers is found in Figure 7. EOP will be output in S2 if compressed timing is selected. Compressed Timing is not allowed for Memory-toMemory transfers. Address Generation - In order to reduce pin count, the HS82C37ARH multiplexes the eight higher order address bits on the data lines. State S1 is used to output the higher order address bits to an external latch from which they may be placed on the address bus. The falling edge of Address Strobe (ADSTB) is used to load these bits from the data lines to the latch. Address Enable (AEN) is used to enable the bits onto the address bus through a three-state enable. The lower order address bits are output by the HS82C37ARH directly. Lines A0-A7 should be connected to the address bus. Figure 4 shows the time relationships between CLK, AEN, ADSTB, DB0-DB7 and A0-A7. During Block and Demand Transfer Mode service, which include multiple transfers, the addresses generated will be sequential. For many transfers the data held in the external address latch will remain the same. This data need only change when a carry or borrow from A7 to A8 takes place in the normal sequence of addresses. To save time and speed transfers, the HS-82C37ARH executes S1 states only when updating of A8-A15 in the latch is necessary. This means for long services, S1 states and Address Strobes may occur only once every 256 transfers, a savings of 255 clock cycles for each 256 transfers.
Note that a problem can occur if a DMA request occurs on an unmasked channel while the HS-82C37ARH is being programmed. For instance, the CPU may be starting to reprogram the two byte Address Register of channel 1 when channel 1 receives a DMA request. If the HS-82C37ARH is enabled (bit 2 in the command register is 0), and channel 1 is unmasked, a DMA service will occur after only one byte of the Address Register has been reprogrammed. This condition can be avoided by disabling the controller (setting bit 2 in the Command Register) or masking the channel before programming any of its registers. Once the programming is complete, the controller can be enabled/unmasked. After power-up it is suggested that all internal locations be loaded with some known value, even if some channels are unused. This will aid in debugging.
Register Description
Current Address Register - Each channel has a 16-bit Current Address Register. This register holds the value of the address used during DMA transfers. The address is automatically incremented or decremented after each transfer and the values of the address are stored in the Current Address Register during the transfer. This register is written or read by the microprocessor in successive 8-bit bytes. It may also be reinitialized by an Autoinitialize back to its original value. Autoinitialize takes place only after an EOP. In Memory-to-Memory Mode, the channel 0 Current Address Register can be prevented from incrementing or decrementing by setting the address hold bit in the Command Register. Current Word Register - Each channel has a 16-Bit Current Word Count Register. This register determines the number of transfers to be performed. The actual number of transfers will be one more than the number programmed in the Current Word Count Register (i.e., programming a count of 100 will result in 101 transfers). The word count is decremented after each transfer. When the value in the register goes from zero to FFFFH, a TC will be generated. This register is loaded or read in successive 8-bit bytes by the microprocessor in the Program Condition. Following the end of a DMA service it may also be reinitialized by an Autoinitialization back to its original value. Autoinitialization can occur only when an EOP occurs. If it is not Autoinitialized, this register will have a count of FFFFH after TC. Base Address and Base Word Count Registers - Each channel has a pair of Base Address and Base Word Count Registers. These 16-bit registers store the original value of their associated current registers. During Autoinitialization, these values are used to restore the current registers to their original values. The base registers are written simultaneously with their corresponding current register in 8-bit bytes in the Program Condition by the microprocessor. These registers cannot be read by the microprocessor. Spec Number
518058
939
HS-82C37ARH
Mask Register - Each channel has associated with it a mask bit which can be set to disable an incoming DREQ. Each mask bit is set when its associated channel produces an EOP if the channel is not programmed to Autoinitialize. Each bit of the 4-bit Mask Register may also be set or cleared separately or simultaneously under soft-ware control. The entire register is also set by a Reset or Master Clear. This disables all hardware DMA requests until a clear Mask Register instruction allows them to occur. The instruction to separately set or clear the mask bits is similar in form to that used with the Request Register. Refer to the following table and Figure 10 for details. When reading the Mask Register, bits 4-7 will always read as logical ones, and bits 0-3 will display the mask bits of channel 0-3, respectively. The 4 bits of the Mask Register may be cleared simultaneously by using the Clear Mask Register command (see software commands section). Mask Register
7 6 5 4 3 2 1 0 00 01 10 11 0 1 BIT NUMBER SELECT CHANNEL 0 MASK BIT SELECT CHANNEL 1 MASK BIT SELECT CHANNEL 2 MASK BIT SELECT CHANNEL 3 MASK BIT CLEAR MASK BIT SET MASK BIT
Mode Register - Each channel has a 6-bit Mode Register associated with it. When the register is being written to by the microprocessor in the Program Condition, bits 0 and 1 determine which channel Mode Register is to be written. When the processor reads a Mode Register, bits 0 and 1 will both be ones. See the adjacent table and Figure 10 for Mode Register functions and addresses. Mode Register
7 6 5 4 3 2 1 0 00 01 10 11 XX 00 01 10 11 XX 0 1 0 1 00 01 10 11 BIT NUMBER
CHANNEL 0 SELECT CHANNEL 1 SELECTT CHANNEL 2 SELECT CHANNEL 3 SELECT READBACK VERIFY TRANSFER WRITE TRANSFER READ TRANSFER ILLEGAL IF BITS 6 AND 7 = 11 AUTOINITIALIZATION DISABLE AUTOINITIALIZATION ENABLE ADDRESS INCREMENT SELECT ADDRESS DECREMENT SELECT DEMAND MODE SELECT SINGLE MODE SELECT BLOCK MODE SELECT CASCADE MODE SELECT
DON'T CARE
All four bits of the Mask Register may also be written with a single command.
7 6 5 4 3 2 1 0 BIT NUMBER 0 CLEAR CHANNEL 0 MASK BIT 1 SET CHANNEL 0 MASK BIT 0 CLEAR CHANNEL 1 MASK BIT 1 SET CHANNEL 1 MASK BIT 0 CLEAR CHANNEL 2 MASK BIT 1 SET CHANNEL 2 MASK BIT 0 CLEAR CHANNEL 3 MASK BIT 1 SET CHANNEL 3 MASK BIT
DON'T CARE, WRITE ALL ONES, READ
Request Register - The HS-82C37ARH can respond to requests for DMA service which are initiated by software as well as by a DREQ. Each channel has a request bit associated with it in the 4-bit Request Register. These are nonmaskable and subject to prioritization by the Priority Encoder network. Each register bit is set or reset separately under software control. The entire register is cleared by a Reset. To set or reset a bit, the software loads the proper form of the data word. See Figure 10 for register address coding, and the following table for Request Register format. A software request for DMA operation can be made in Block or Single Modes. For Memory-to-Memory transfers, the software request for channel 0 should be set. When reading the Request Register, bits 4-7 will always read as ones, and bits 0-3 will display the request bits of channels 0-3 respectively. Request Register
7 6 5 4 3 2 1 0 00 01 10 11 0 1 BIT NUMBER SELECT CHANNEL 0 SELECT CHANNEL 1 SELECT CHANNEL 2 SELECT CHANNEL 3 RESET REQUEST BIT SET REQUEST BIT
DON'T CARE, WRITE BITS 4-7 ALL ONES, READ
Spec Number 940
518058
HS-82C37ARH
Command Register - This 8-bit register controls the operation of the HS-82C37ARH. It is programmed by the microprocessor and is cleared by Reset or a Master Clear instruction. The adjacent table lists the function of the command bits. See Figure 10 for Read and Write addresses. Command Register
7 6 5 4 3 2 1 0 BIT NUMBER 0 MEM-TO-MEM DISABLE 1 MEM-TO-MEM ENABLE 0 CH. 0 ADDR. HOLD DISABLE 1 CH. 0 ADDR. HOLD ENABLE X IF BIT 0 = 0 0 CONTROLLER ENABLE 1 CONTROLLER DISABLE 0 NORMAL TIMING 1 COMPRESSED TIMING X IF BIT 0 = 1 0 FIXED PRIORITY 1 ROTATING PRIORITY 0 LATE WRITE SELECTION 1 EXTENDED WRITE SEL. X IF BIT 3 = 1 0 DREQ SENSE ACTIVE HIGH 1 DREQ SENSE ACTIVE LOW 0 DACK SENSE ACTIVE LOW 1 DACK SENSE ACTIVE HIGH
Status Register - The Status Register contains information about the present status of the HS-82C37ARH and can be read by the microprocessor. This information includes which channels have reached a terminal count and which channels have pending DMA requests. Bits 0-3 are set every time a TC is reached by that channel or an external EOP is applied. These bits are cleared upon Reset, Master Clear, and on each Status Read. Bits 4-7 are set whenever their corresponding channel is requesting service, regardless of the mask bit state. If the mask bits are set, software can poll the Status Register to determine which channels have DREQs, and selectively clear a mask bit, thus allowing user defined service priority. Status bits 4-7 are updated while the clock is high, and latched on the falling edge. Status Bits 4-7 are cleared upon Reset or Master Clear. Status Register
7 6 5 4 3 2 1 0 1 1 1 1 1 1 1 1 BIT NUMBER CHANNEL 0 HAS REACHED TC CHANNEL 1 HAS REACHED TC CHANNEL 2 HAS REACHED TC CHANNEL 3 HAS REACHED TC CHANNEL 0 REQUEST CHANNEL 1 REQUEST CHANNEL 2 REQUEST CHANNEL 3 REQUEST
Temporary Register - The Temporary Register is used to hold data during Memory-to-Memory transfers. Following the completion of the transfer, the last word moved can be read by the microprocessor by accessing this register. The Temporary Register always contains the last byte transferred in the previous Memory-to-Memory operation, unless cleared by a Reset or Master Clear.
OPERATION Read Status Register Write Command Register Read Request Register Write Request Register Read Command Register Write Single Mask Bit Read Mode Register Write Mode Register Set Byte Pointer F/F Clear Byte Pointer F/F Read Temporary Register Master Clear Clear Mode Reg. Counter Clear Mask Register Read All Mask Bits Write All Mask Bits A3 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 A2 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 A1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 A0 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 IOR 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 IOW 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0
FIGURE 10. SOFTWARE COMMAND CODES AND REGISTER CODES
Spec Number 941
518058
HS-82C37ARH Software Commands
There are special software commands which can be executed by reading or writing to the HS-82C37ARH. These commands do not depend on the specific data pattern on the data bus, but are activated by the I/O operation itself. On read type commands, the data value is not guaranteed. These commands are: Clear First/Last Flip-Flop: This command is executed prior to writing or reading new address or word count information to the HS-82C37ARH. This initializes the flip-flop to a known state so that subsequent accesses to register contents by the microprocessor will address upper and lower bytes in the correct sequence. Set First/Last Flip-Flop: This command will set the flip-flop to select the high byte first on read and write operations to Address and Word Count registers. Master Clear: This software instruction has the same effect as the hardware Reset. The Command, Status, Request, and Temporary Registers, and Internal First/Last Flip-Flop and Mode Register Counter are cleared and the Mask Register is set. The HS-82C37ARH will enter the Idle cycle. Clear Mask Register: This command clears the mask bits of all four channels, enabling them to accept DMA requests.
OPERA TION Write Read Write Read Write Read Write Read Write Read Write Read Write Read Write Read
Clear Mode Register Counter: Since only one address location is available for reading the Mode Registers, an internal two-bit counter has been included to select Mode Registers during read operations. To read the Mode Registers, first execute the Clear Mode Register Counter command, then do consecutive reads until the desired channel is read. Read order is channel 0 first, channel 3 last. The lower two bits on all Mode Registers will read as ones.
External EOP Operation
The EOP pin is a bidirectional, open drain pin which may be driven by external signals to terminate DMA operation. Because EOP is an open drain pin an external pull-up resistor is required. The value of the external pull-up resistor used should guarantee a rise time of less than 125ns. It is important to note that the HS-82C37ARH will not accept external EOP signals when it is in an SI (Idle)state. The controller must be active to latch EXT EOP. Once latched, the EXT EOP will be acted upon during the next S2 state, unless the HS-82C37ARH enters an Idle state first. In the latter case the latched EOP is cleared. External EOP pulses occurring between active DMA transfers in demand mode will not be recognized, since the HS-82C37ARH is in an SI state.
SIGNALS
CHANNEL 0
REGISTER Base and Current Address Current Address Base and Current Word Count Current Word Count
CS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
IOR 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0
IOW 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1
A3 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
A2 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
A1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1
A0 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1
INTERNAL FLIP-FLOP 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1
DATA BUS DB0-DB7 A0-A7 A8-A15 A0-A7 A8-A15 W0-W7 W8-W15 W0-W7 W8-W15 A0-A7 A8-A15 A0-A7 A8-A15 W0-W7 W8-W15 W0-W7 W8-W15 A0-A7 A8-A15 A0-A7 A8-A15 W0-W7 W8-W15 W0-W7 W8-W15 A0-A7 A8-A15 A0-A7 A8-A15 W0-W7 W8-W15 W0-W7 W8-W15
1
Base and Current Address Current Address Base and Current Word Count Current Word Count
2
Base and Current Address Current Address Base and Current Word Count Current Word Count
3
Base and Current Address Current Address Base and Current Word Count Current Word Count
FIGURE 11. WORD COUNT AND ADDRESS REGISTER COMMAND CODES
Spec Number 942
518058
HS-82C37ARH Application Information
Figure 12 shows an application for a DMA system utilizing the HS-82C37ARH DMA controller and the HS-80C86RH Microprocessor. In this application, the HS-82C37ARH DMA controller is used to improve system performance by allowing an I/O device to transfer data directly to or from system memory. Components The system clock is generated by the HS-82C85RH clock controllers generator and is inverted to meet the clock high and low times required by the HS-82C37ARH DMA controller. The four OR gates are used to support the HS-80C86RH Microprocessor in minimum mode by producing the control signals used by the processor to access memory or I/O. A decoder is used to generate chip select for the DMA controller and memory. The HS-82C37ARH multiplexes the most significant bits of the address on its data outputs (DB0 - 7), so the 82C82 octal latch is used to demultiplex the address. A three-state inverter is used to generate the BHE signal using the A0 output of the HS-82C37ARH. Hold Acknowledge (HLDA) and Address Enable (AEN) are "ORed" together and used to deactivate the microprocessors 82C82 transceiver to insure that the DMA controller does not have bus contention with the microprocessor. Operation A DMA request (DREQ) is generated by the I/O device. After receiving the DMA request, the DMA controller will issue a Hold Request (HRQ) to the processor. The system busses are not released to the DMA controller until a Hold Acknowledge (HLDA) signal is returned to the DMA controller from the HS-80C86RH processor. After the Hold Acknowledge has been received, addresses and control signals are generated by the DMA controller to accomplish the DMA transfers. Data is transferred directly from the I/O device to memory (or vice versa) with IOR and MEMW (or MEMR and IOW) being active. Note that data is not read into or driven out of the DMA controller in I/O-to-Memory or Memory-to-I/O data transfers.
MEMCS HLDA DECODER HS-82C37ARH HS-82C85RH HLDA HRQ CLK CS ADSTB OE AEN EOP HLDA IOR IOW AD15 M/10 RD WR BHE MN/MX VDD OE 82C82 DATA BUS STB 82C82 A0-7 DB0-7 MEMR MEMW HRQ DREQ0 DACK0
VDD
ALE AD0
STB
CLK
ADDRESS BUS
HS-80C86RH BHE MEMR MEMW IOR IOW MEMCS MEMR MEMW MEMORY DATA BUS IOR IOW ADDRESS BUS I/O DEVICE CS DREQ A0
FIGURE 12. APPLICATION FOR DMA SYSTEM
Spec Number 943
518058
HS-82C37ARH Metallization Topology
DIE DIMENSIONS: 215 x 232 mils x 19 1 mil METALLIZATION: Type: Al/Si Thickness: 11kA 2kA GLASSIVATION: Thickness: 8kA 1kA WORST CASE CURRENT DENSITY: 7.9 x 104 A/cm2
Metallization Mask Layout
HS-82C37ARH
(6) READY (4) MEMW (3) MEMR (36) EOP
(2) IOW
(40) A7
(39) A6
(38) A5
(37) A4
HLDA (7) (34) A2 ADSTB (8)
(1) IOR
(35) A3
(5) NC
(33) A1
AEN (9)
(32) A0
HRQ (10)
(31) VDD
CS (11)
(30) DB0
(29) DB1 CLK (12) (28) DB2 RESET (13) DACK2 (14) (27) DB3
(26) DB4
DACK3 (15)
DACK1 (24)
DREQ3 (16)
DREQ2 (17)
DREQ1 (18)
DREQ0 (19)
DACK0 (25)
DB7 (21)
DB6 (22)
VSS (20)
DB5 (23)
Spec Number 944
518058
HS-82C37ARH Packaging
1
E N A A D b E1 L C Q E2 A S1
K42.A TOP BRAZED 42 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE
INCHES SYMBOL A b b1 c c1 D E MIN 0.017 0.017 0.007 0.007 1.045 0.630 0.530 MAX 0.100 0.025 0.023 0.013 0.010 1.075 0.650 0.680 0.550 MILLIMETERS MIN 0.43 0.43 0.18 0.18 26.54 16.00 13.46 MAX 2.54 0.64 0.58 0.33 0.25 27.31 16.51 17.27 13.97 NOTES 3 3 11 8.89 1.65 0.04 42 8 6 Rev. 0 6/17/94
e
c1
LEAD FINISH
E1 E2
BASE METAL b1 M M (b) SECTION A-A
(c)
e k L Q S1 M N
0.050 BSC 0.320 0.045 0.000 42 0.350 0.065 0.0015 -
1.27 BSC
8.13 1.14 0.00 -
NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer's identification shall not be used as a pin one identification mark. Alternately, a tab (dimension k) may be used to identify pin one. 2. If a pin one identification mark is used in addition to a tab, the limits of dimension k do not apply. 3. This dimension allows for off-center lid, meniscus, and glass overrun. 4. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 5. N is the maximum number of terminal positions. 6. Measure dimension S1 at all four corners. 7. For bottom-brazed lead packages, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. 8. Dimension Q shall be measured at the point of exit (beyond the meniscus) of the lead from the body. Dimension Q minimum shall be reduced by 0.0015 inch (0.038mm) maximum when solder dip lead finish is applied. 9. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 10. Controlling dimension: INCH. 11. The basic lead spacing is 0.050 inch (1.27mm) between center lines. Each lead centerline shall be located within 0.005 inch (0.13mm) of its exact longitudinal position relative to lead 1 and the highest numbered (N) lead.
Spec Number 945
518058
HS-82C37ARH
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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Sales Office Headquarters
NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (407) 724-7000 FAX: (407) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. Taiwan Limited 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029
Spec Number 946

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